Iron Circuit Board Repair Solder Paste
10 reviews

FEATURES:


Advanced insulation technology,  a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips.
The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board.
Super compacity:  Soldering paste for cell phone PCB, SMD, PGA and computer etc.
Help to repair the circuit boards and protect the electronic components
Flux Solder Paste - no clean soldering
Syringe solder paste is an ideal assistant for phone motherboard and repairing cell phone surface mount assemblies.
The syringe plunger will provide premium activity levels with maximum wetting and spreading, 10cc syringe is available for all rework soldering and desoldering repairs.
High quality, perfect performance, easy to weld.
Suitable for mobile phone repair industry, computer digital service industry, high-precision circuit board SMD welding, BGA welding technology and so on.

SPECIFICATIONS:


Material:   Tin+Solder Past
Type: BGA Soldering Tin Cream
Volume: 10CC
Alloy: Sn63/Pb37 
Design: Squeeze tube needle dispense
Microns: 20-38u
Application: Applicable to Phone PCB, BGA, SMD, PGA Repair
Usage: PCB BGA Repairing Tool
Function: Repair the Circuit Boards, Protect The Electronic Components

WARRANTY

We'll refund your money if the item hasn't been delivered within 40 days after purchase. You have 2 weeks to request a refund — until day 60.
Product doesn't match the description? Contact us within 30 days after you receive it!
In case of cancellation, money will be refunded to your account within 3 days.