Xg-50 Sn63/pb37 Soldering Paste For Mobile Phone Pcb Repair
10 reviews

FEATURES:


Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on good soldering and welding tool.
Unleaded MECHANIC BGA Solder Flux Paste Soldering Tin Cream Professional for BGA Soldering Iron Station.
Free lead solder paste, 183 ?, the degree of melting point, easy welding, easy molding.

SPECIFICATIONS:


Material: Plastic+solder paste.
Type: XG-50 , 35g
Alloy: Sn63/Pb37.
Microns: 25-45um.
Application: for BGA motherboard soldering iron station flux cream.
Function: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
Hi-Performance.
Storage Condition:0-10°c.

NOTE:


Harmful by inhalation and if swallowed.
Danger of cumulative effects.
Keep away from food ,drink and animal feeding stuffs.
When using do not eat ,Drink or smoke.
Avoid prolonged or repeated contact of any skin with solder paste. In case of solder paste ingestion see a doctor immediately.
Store container well closed and cool.

WARRANTY

We'll refund your money if the item hasn't been delivered within 40 days after purchase. You have 2 weeks to request a refund — until day 60.
Product doesn't match the description? Contact us within 30 days after you receive it!
In case of cancellation, money will be refunded to your account within 3 days.